Plasma Plate Cutting Machines, Gemini 254PG

CUTTING The Gemini's moving gantry design allows a greater range of plate sizes and thickness, without worrying about plate weight. Cutting plate sizes either 2.5m or 3.2m wide by any length. Fitted with plasmas from 200-400 Amp and optional oxy torches the Gemini can cut plate from <1mm-80mm in mild steel and <1-40mm in stainless brass and aluminium. Marking and scribing: The Gemini can be fitted with a wide variety of marking devices depending on your needs. Bending lines can be marked with a scribing tool, plasma marking or flame powder marking. Identification marks and part numbers for fabrication can be added with the scribing tool, plasma marker, pin marker or inkjet. DRILLING AND TAPPING About 60 of plate parts have holes drilled in them. The Gemini's high speed spindle allows fast drilling of holes up to 30mm. Holes up to 300mm can be milled. The high speed spindle combines with wide clamping area provides high productivity for most common hole sizes e.g. eighteen 22mm holes per minute at 100mm spacing. For tapping the digital control system provided high quality threads an tapped holes as small as 3mm for cable etc. and up to 22mm for structural bolts and above that thread milling can produce threads up to 100mm. EDGE BEVELLING The Gemini can make weld edge preps either by milling or plasma bevelling. For precision bevels milling is more accurate. For variable bevels, large parts and K preps plasma bevelling is the more economical process. For economical welding J preps and thickness reduction can be performed with milling tools. FACE AND SLOT MILLING On machine parts and many structural parts slotted holes, milled bearing/mating faces etc are required. Traditionally these operations were performed on large machining centres or boring machines after fabrication. The accuracy of the Gemini in both cutting and machining means that many of these operations can be performed on the flat piece, thus eliminating the expense, handling cost, floor space and lead-time of later operations.